✦ LIBER ✦

The effect of thiourea,l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

✍ Scribed by Tadesse, Bogale; Horne, Michael; Addai-Mensah, Jonas

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of thiourea on the electrodeposit

✍ L. I. Gurevich; A. V. Pomosov 📂 Article 📅 1972 🏛 Springer 🌐 English ⚖ 639 KB

Effect of chromate additive on the kinet

✍ A.J. Smith; L. Ma; T. Tran; M.S. Wainwright 📂 Article 📅 2000 🏛 Springer 🌐 English ⚖ 224 KB

The Effect of Some Addition Agents on th

✍ Turner, D. R.; Johnson, G. R. 📂 Article 📅 1962 🏛 The Electrochemical Society 🌐 English ⚖ 997 KB

Dynamic Scaling Exponents of Copper Elec

✍ Mendez, S.; Andreasen, G.; Schilardi, P.; Figueroa, M.; Vázquez, L.; Salvarezza, 📂 Article 📅 1998 🏛 American Chemical Society 🌐 English ⚖ 288 KB

Kinetics and mechanism of the technetium

✍ F. Grases; J. Palou; E. Amat 📂 Article 📅 1986 🏛 Springer 🌐 English ⚖ 300 KB

Influence of thiourea and thiourea agein

✍ G. Fabricius; K. Kontturi; G. Sundholm 📂 Article 📅 1996 🏛 Springer 🌐 English ⚖ 426 KB