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Influence of thiourea and thiourea ageing on the electrodeposition of copper from acid sulfate solutions studied by the ring-disc technique

โœ Scribed by G. Fabricius; K. Kontturi; G. Sundholm


Publisher
Springer
Year
1996
Tongue
English
Weight
426 KB
Volume
26
Category
Article
ISSN
0021-891X

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โœ G. Fabricius ๐Ÿ“‚ Article ๐Ÿ“… 1994 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 182 KB

The effects of thiourea on the mechanism of the Cu/Ct?+ system were studied using Pt/Pt and Cu/Pt rotating ring disc electrodes in a 0.7 M CuS04-1.8 M H,SO, solution. Thiourea at low concentrations inhibits the reduction of the intermediate Cu+ to Cu on a copper surface. Thus more Cu+ escapes from t