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A rotating ring-disc study of the influence of thiourea on the electrodeposition of copper from acid sulphate solutions

✍ Scribed by G. Fabricius

Publisher
Elsevier Science
Year
1994
Tongue
English
Weight
182 KB
Volume
39
Category
Article
ISSN
0013-4686

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✦ Synopsis

The effects of thiourea on the mechanism of the Cu/Ct?+ system were studied using Pt/Pt and Cu/Pt rotating ring disc electrodes in a 0.7 M CuS04-1.8 M H,SO, solution. Thiourea at low concentrations inhibits the reduction of the intermediate Cu+ to Cu on a copper surface. Thus more Cu+ escapes from the disc into solution and the amount of Cu+ observed at the ring grows with thiourea concentration. At high thiourea concentrations, the amount of Cu+ reaching the ring becomes very small because of complexation effects.

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