The effects of thiourea on the mechanism of the Cu/Ct?+ system were studied using Pt/Pt and Cu/Pt rotating ring disc electrodes in a 0.7 M CuS04-1.8 M H,SO, solution. Thiourea at low concentrations inhibits the reduction of the intermediate Cu+ to Cu on a copper surface. Thus more Cu+ escapes from t
Influence of thiourea on the nucleation of copper from acid sulphate solutions
β Scribed by G. Fabricius; K. Kontturi; G. Sundholm
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 497 KB
- Volume
- 39
- Category
- Article
- ISSN
- 0013-4686
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