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Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening

✍ Scribed by Mendez, S.; Andreasen, G.; Schilardi, P.; Figueroa, M.; Vázquez, L.; Salvarezza, R. C.; Arvia, A. J.


Book ID
118034581
Publisher
American Chemical Society
Year
1998
Tongue
English
Weight
288 KB
Volume
14
Category
Article
ISSN
0743-7463

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