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Effect of thiourea on the electrodeposition of copper powder

โœ Scribed by L. I. Gurevich; A. V. Pomosov


Book ID
112419486
Publisher
Springer
Year
1972
Tongue
English
Weight
639 KB
Volume
11
Category
Article
ISSN
1573-9066

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Adsorption of thiourea on polycrystallin
โœ Magali Quinet; Fabrice Lallemand; Laurence Ricq; Jean-Yves Hihn; Patrick Delobel ๐Ÿ“‚ Article ๐Ÿ“… 2010 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 763 KB

Although previous works have shown the marked influence of thiourea as an organic additive in electrolyte bulk on copper electrodeposition, a variety of mechanisms could be responsible. The present paper concerns the effect of a thiourea layer adsorbed prior to copper electrodeposition. First eviden