The stabilization of electrodeposited copper powder
β Scribed by R. Walker; S.J. Duncan
- Publisher
- Elsevier Science
- Year
- 1986
- Tongue
- English
- Weight
- 521 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0257-8972
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The surface topography of copper deposits, grown from acid copper sulphate solutions on electropolished copper cathodes, varies with the orientation of the original cathode surface. The deposit structures fall into groups which may be related to the atomic configuration of the original cathode surf
Palladium was deposited galvanostatically and potentiostatically from complex chloride solutions at various eds and potentials . The properties of the deposits were studied by a number of methods . The roughness measured with a mechanical profilometer strongly increased upon reaching