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The structure of electrodeposited copper—I: An experimental study of the growth of copper during electrodeposition

✍ Scribed by H.J. Pick; G.G. Storey; T.B. Vaughan

Publisher
Elsevier Science
Year
1960
Tongue
English
Weight
883 KB
Volume
2
Category
Article
ISSN
0013-4686

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✦ Synopsis

The surface topography of copper deposits, grown from acid copper sulphate solutions on electropolished copper cathodes, varies with the orientation of the original cathode surface.

The deposit structures fall into groups which may be related to the atomic configuration of the original cathode surface. The nature of the variation can be explained on the hypothesis that growth proceeds by a bunching mechanism. A test of this hypothesis is that the surface geometry of deposits should be independent of plating time, and that the scale of the surface features should increase with time. An electron microscope examination of surface topography, covering a range of crystal orientations and plating times, confirms the hypothesis.

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