𝔖 Bobbio Scriptorium

✦ LIBER ✦

The application of laser process technology to thin film packaging : Thomas F. Redmond et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 6 (February 1993)

Publisher: Elsevier Science
Year: 1994
Tongue: English
Weight: 104 KB
Volume: 34
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(94)90434-0

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A low cost manufacturing process for hig

A low cost manufacturing process for high density hybrid components based on multilayer polyimide—ceramic structures : Manuel Tudanca et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 13 (February 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 104 KB

A method of adhesion strength test for t

A method of adhesion strength test for thick film : Kunio Yata et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(6), 584 (September 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 104 KB

Zero-defect sputter deposition metalliza

Zero-defect sputter deposition metallization method for high volume manufacturing of grafted multilayer thin film modules : Tom Swirbel. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 1 (February 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 111 KB

New mode crack of LSI package in the sol

New mode crack of LSI package in the solder reflow process : Mitusuru Adachi et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 550 (August 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 106 KB

Factors affecting the interconnection re

Factors affecting the interconnection resistance and yield in multilayer polyimide—copper structures : Da-Yuan Shih et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 74 (February 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 112 KB

Relative figures of merit for chip-to-MC

Relative figures of merit for chip-to-MCM substrate interconnection methods : Udbhava A. Shrivastava et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(6), 598 (September 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 220 KB