𝔖 Bobbio Scriptorium

✦ LIBER ✦

New mode crack of LSI package in the solder reflow process : Mitusuru Adachi et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 550 (August 1993)

Publisher: Elsevier Science
Year: 1994
Tongue: English
Weight: 106 KB
Volume: 34
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(94)90406-5

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Statistics of solder joint alignment for

Statistics of solder joint alignment for optoelectronic components : John McGroarty et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 527 (August 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 105 KB

Effects of parylene coating on the therm

Effects of parylene coating on the thermal fatigue life of solder joints in ceramic packages : Ho-Ming Tong et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 571 (August 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 108 KB

The application of laser process technol

The application of laser process technology to thin film packaging : Thomas F. Redmond et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 6 (February 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 104 KB

Finite-difference time-domain analysis o

Finite-difference time-domain analysis of pulse propagation in multichip module interconnects : Michael Gribbons et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 490 (August 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 112 KB

Module frequency estimation and noise bu

Module frequency estimation and noise budget limitations/trade-offs in multichip modules as a function of CMOS chips integration : Ramesh Senthinathan. et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(5), 478 (August 1993)

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 217 KB