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✦ LIBER ✦
Factors affecting the interconnection resistance and yield in multilayer polyimide—copper structures : Da-Yuan Shih et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 74 (February 1993)
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 112 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0026-2714
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