Relative figures of merit for chip-to-MCM substrate interconnection methods : Udbhava A. Shrivastava et al. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(6), 598 (September 1993)

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 220 KB
• Volume: 34
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(94)90393-x