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Testing of TSV-Induced Small Delay Faults for 3-D Integrated Circuits

✍ Scribed by Kuo, Chun-Yi; Shih, Chi-Jih; Lu, Yi-Chang; Li, James Chien-Mo; Chakrabarty, Krishnendu

Book ID: 120166801
Publisher: IEEE
Year: 2014
Tongue: English
Weight: 639 KB
Volume: 22
Category: Article
ISSN: 1063-8210
DOI: 10.1109/TVLSI.2013.2250320

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