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[IEEE 2012 IEEE International Symposium on Circuits and Systems - ISCAS 2012 - Seoul, Korea (South) (2012.05.20-2012.05.23)] 2012 IEEE International Symposium on Circuits and Systems - Substrate noise suppression technique for power integrity of TSV 3D integration

✍ Scribed by Yang, Po-Jen; Huang, Po-Tsang; Hwang, Wei

Book ID: 120633886
Publisher: IEEE
Year: 2012
Weight: 550 KB
Category: Article
ISBN: 1467302171
DOI: 10.1109/ISCAS.2012.6272024

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