Surface reactions of copper films in O2/CF4/N2 plasmas

✍ Scribed by D. D. Coolbaugh; L. J. Matienzo; F. D. Egitto; A. R. Knoll

• Book ID: 104592422
• Publisher: John Wiley and Sons
• Year: 1990
• Tongue: English
• Weight: 474 KB
• Volume: 15
• Category: Article
• ISSN: 0142-2421
• DOI: 10.1002/sia.740150210

✦ Synopsis

Abstract

Copper surfaces treated with O~2~/CF~4~ and O~2~/CF~4~/N~2~ plasmas have been characterized using x‐ray photoelectron and Auger electron spectroscopy. Deeper oxidation and fluorination result for oxygen‐rich mixtures than for CF~4~‐rich gas feeds. Film thicknesses increase with time of exposure. Copper oxidation is always deeper than fluorination for O~2~/CF~4~ mixtures. It appears that penetration of fluorine is more facile through the copper oxide matrix than through the metallic copper film. With addition of 5% N~2~, concentration of fluorine is enhanced relative to oxygen. These observations are discussed with respect to gas phase and surface reactions involving oxygen, fluorine and nitrogen.