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Effects of O 2 - and N 2 -Plasma Treatments on Copper Surface

✍ Scribed by Chiang, Chiu-Chih; Chen, Mao-Chieh; Li, Lain-Jong; Wu, Zhen-Cheng; Jang, Syun-Ming; Liang, Mong-Song

Book ID
127036844
Publisher
Institute of Pure and Applied Physics
Year
2004
Tongue
English
Weight
206 KB
Volume
43
Category
Article
ISSN
0021-4922

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πŸ“œ SIMILAR VOLUMES

Surface reactions of copper films in O2/
Surface reactions of copper films in O2/CF4/N2 plasmas
✍ D. D. Coolbaugh; L. J. Matienzo; F. D. Egitto; A. R. Knoll πŸ“‚ Article πŸ“… 1990 πŸ› John Wiley and Sons 🌐 English βš– 474 KB

## Abstract Copper surfaces treated with O~2~/CF~4~ and O~2~/CF~4~/N~2~ plasmas have been characterized using x‐ray photoelectron and Auger electron spectroscopy. Deeper oxidation and fluorination result for oxygen‐rich mixtures than for CF~4~‐rich gas feeds. Film thicknesses increase with time of