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Surface characterization of nickel alloy plasma-treated by O2/CF4 mixture

✍ Scribed by Chan-Park, Mary B.; Gao, Jianxia; Koo, Arthur H. L.


Book ID
120435663
Publisher
Taylor and Francis Group
Year
2003
Tongue
English
Weight
467 KB
Volume
17
Category
Article
ISSN
0169-4243

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Surface reactions of copper films in O2/
✍ D. D. Coolbaugh; L. J. Matienzo; F. D. Egitto; A. R. Knoll πŸ“‚ Article πŸ“… 1990 πŸ› John Wiley and Sons 🌐 English βš– 474 KB

## Abstract Copper surfaces treated with O~2~/CF~4~ and O~2~/CF~4~/N~2~ plasmas have been characterized using x‐ray photoelectron and Auger electron spectroscopy. Deeper oxidation and fluorination result for oxygen‐rich mixtures than for CF~4~‐rich gas feeds. Film thicknesses increase with time of