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Problems of Surface Morphology and Layer Deposition during Plasma Etching Processes (II) Si-etching in CF4-, CF4/O2-and CF4/H2 Plasmas

✍ Scribed by H.-J. Tiller; J. Krausse; R. Voigt

Publisher: John Wiley and Sons
Year: 1982
Tongue: English
Weight: 355 KB
Volume: 17
Category: Article
ISSN: 0232-1300
DOI: 10.1002/crat.2170170706

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