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Problems of surface morphology and layer deposition during plasma etching processes (III) SiO2-etching in CF4 plasma

✍ Scribed by Dr. H.-J. Tiller; J. Krausse

Publisher: John Wiley and Sons
Year: 1982
Tongue: English
Weight: 379 KB
Volume: 17
Category: Article
ISSN: 0232-1300
DOI: 10.1002/crat.2170170918

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