✦ LIBER ✦

Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints

✍ Scribed by Yung-Chi Lin; Toung-Yi Shih; Shih-Kang Tien; Jenq-Gong Duh

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Controlling intermetallic compound growt

✍ Szu-Tsung Kao; Yung-Chi Lin; Jenq-Gong Duh 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 448 KB

Suppressing Ni3Sn4 formation in the Sn–A

✍ Chien-Fu Tseng; Tae-Kyu Lee; Gnyaneshwar Ramakrishna; Kuo-Chuan Liu; Jenq-Gong D 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 836 KB

Phase transformation of the phosphorus-r

✍ Yung-Chi Lin; Jenq-Gong Duh 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 218 KB

Effects of Solder Volume on Formation an

✍ H.T. Chen; C.Q. Wang; C. Yan; Y. Huang; Y.H. Tian 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 585 KB

Electromigration Study on Sn(Cu) Solder/

✍ S.H. Wu, Y.J. Hu, C.T. Lu, T.S. Huang, Y.H. Chang, C.Y. Liu 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 459 KB

Morphological and Microstructural Evolut

✍ Yung-Chi Lin; Toung-Yi Shih; Shih-Kang Tien; Jenq-Gong Duh 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 598 KB