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Study on residual stress in viscoelastic thin film using curvature measurement method

✍ Scribed by Im, Young Tae ;Choi, Seung Tae ;Park, Tae Sang ;Kim, Jae Hyun

Book ID
105697158
Publisher
Springer-Verlag
Year
2004
Tongue
Korean
Weight
503 KB
Volume
18
Category
Article
ISSN
1226-4865

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In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to rec