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Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture

✍ Scribed by T.-Y Zhang; L.-Q Chen; R Fu

Book ID: 108492357
Publisher: Elsevier Science
Year: 1999
Tongue: English
Weight: 221 KB
Volume: 47
Category: Article
ISSN: 1359-6454
DOI: 10.1016/s1359-6454(99)00248-7

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