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A method for in situ measurement of the residual stress in thin films by using the focused ion beam

✍ Scribed by K.J. Kang; N. Yao; M.Y. He; A.G. Evans

Book ID
108388738
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
747 KB
Volume
443
Category
Article
ISSN
0040-6090

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In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to rec