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Study on effect of coupling agents on underfill material in flip chip packaging

โœ Scribed by Shijian Luo; C. Wong

Book ID
126769248
Publisher
IEEE
Year
2001
Tongue
English
Weight
131 KB
Volume
24
Category
Article
ISSN
1521-3331

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A flip chip package was assembled by using 6-layer laminated polyimide coreless substrate, eutectic Sn37Pb solder bump, two kinds of underfill materials and Sn 3.0 Ag 0.5 Cu solder balls. Regarding to the yield, the peripheral solder joints were often found not to connect with the substrate due to t