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Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

โœ Scribed by Lau, J.H.; Lee, S.-W.R.; Chang, C.

Book ID
121009995
Publisher
IEEE
Year
2000
Tongue
English
Weight
898 KB
Volume
23
Category
Article
ISSN
1521-3331

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A flip chip package was assembled by using 6-layer laminated polyimide coreless substrate, eutectic Sn37Pb solder bump, two kinds of underfill materials and Sn 3.0 Ag 0.5 Cu solder balls. Regarding to the yield, the peripheral solder joints were often found not to connect with the substrate due to t