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Effects of underfill materials on the reliability of low-K flip-chip packaging

✍ Scribed by K.M. Chen; D.S. Jiang; N.H. Kao; J.Y. Lai

Book ID: 108210557
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 565 KB
Volume: 46
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2005.05.001

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