✦ LIBER ✦
Impact of packaging materials on reliability test for low-K wire bond-stacked flip chip CSP
✍ Scribed by K. M. Chen
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 469 KB
- Volume
- 20
- Category
- Article
- ISSN
- 0957-4522
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