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The effects of underfill on the reliability of flip chip solder joints

✍ Scribed by Peng Su; Sven Rzepka; Matt Korhonen; C. Y. Li

Book ID: 107457983
Publisher: Springer US
Year: 1999
Tongue: English
Weight: 505 KB
Volume: 28
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-999-0178-8

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