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[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

✍ Scribed by Lau, J.H.; Lee, S.-W.R.; Chang, C.; Ouyang, C.

Book ID: 125476457
Publisher: IEEE
Year: 1999
Tongue: English
Weight: 915 KB
Edition: 1999
Category: Article
ISBN-13: 9780780352315
DOI: 10.1109/ectc.1999.776237

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