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[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - A simple evaluation methodology of Young's modulus-temperature relationship for the underfill encapsulants

✍ Scribed by Rao, Y.; Shi, S.H.; Wong, C.P.

Book ID: 121006718
Publisher: IEEE
Year: 1999
Tongue: English
Weight: 396 KB
Edition: 1999
Category: Article
ISBN-13: 9780780352315
DOI: 10.1109/ECTC.1999.776271

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