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[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Development of BGA solder joint vibration fatigue life prediction model

✍ Scribed by Wong, T.E.; Reed, B.A.; Cohen, H.M.; Chu, D.W.

Book ID: 125911814
Publisher: IEEE
Year: 1999
Tongue: English
Weight: 505 KB
Edition: 1999
Category: Article
ISBN-13: 9780780352315
DOI: 10.1109/ECTC.1999.776163

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