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Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly

✍ Scribed by Gamota, D.; Melton, C.

Book ID: 114560646
Publisher: IEEE
Year: 1998
Weight: 170 KB
Volume: 21
Category: Article
ISSN: 1083-4400
DOI: 10.1109/3476.670029

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