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Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

✍ Scribed by Tsai, Ming-Yi; Tang, Chung-Yi; Yen, Chia-Yi; Chang, Liann-Be

Book ID: 121010065
Publisher: IEEE
Year: 2014
Tongue: English
Weight: 961 KB
Volume: 14
Category: Article
ISSN: 1530-4388
DOI: 10.1109/TDMR.2013.2248365

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