✦ LIBER ✦
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study
✍ Scribed by Woon-Seong Kwon; Suk-Jin Ham; Kyung-Wook Paik
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 655 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0026-2714
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