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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging

✍ Scribed by Endut, Zulkarnain; Ahmad, Ibrahim; Zaharim, Azami; Sukemi, Norazham

No coin nor oath required. For personal study only.

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