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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Modelling the behavior of solder joints for wafer level SiP

✍ Scribed by Strusevich, N.; Stoyanov, S.; Liu, D.; Bailey, C.; Richardson, A.; Dumas, N.; Yannou, J.M.; Georgel, V.

No coin nor oath required. For personal study only.

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