✦ LIBER ✦

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Hot embossing on polymethyl methacrylate

✍ Scribed by Ng, Sum; Tjeung, Ricky; Wang, Zhenfeng

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2006 8th Electronics Packaging Tec

✍ Loher, Thomas; Manessis, Dion; Heinrich, Ralf; Schmied, Benno; Vanfleteren, Jan; 📂 Article 📅 2006 🏛 IEEE 🌐 English ⚖ 342 KB

[IEEE 2006 8th Electronics Packaging Tec

✍ Qi, Chao; Sivakumar, Appa 📂 Article 📅 2006 🏛 IEEE ⚖ 251 KB

[IEEE 2006 8th Electronics Packaging Tec

✍ Strusevich, N.; Stoyanov, S.; Liu, D.; Bailey, C.; Richardson, A.; Dumas, N.; Ya 📂 Article 📅 2006 🏛 IEEE ⚖ 390 KB

[IEEE 2006 8th Electronics Packaging Tec

✍ Sunappan, V.; Vadiveloo, P.L.; Wai, L.L.; Fan, W.; Lu, C.W. 📂 Article 📅 2006 🏛 IEEE ⚖ 288 KB

[IEEE 2006 8th Electronics Packaging Tec

✍ Lok, B.K.; Ng, P.Y.; Hu, X.; Low, H.P. 📂 Article 📅 2006 🏛 IEEE 🌐 English ⚖ 707 KB

[IEEE 2006 8th Electronics Packaging Tec

✍ Szabo, P.; Rencz, M.; Farkas, G.; Poppe, A. 📂 Article 📅 2006 🏛 IEEE 🌐 English ⚖ 512 KB