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[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - The effect of current crowding on electromigration in lead-free flip chip bump interconnect

โœ Scribed by Wang Lei, ; Wu Fengshun, ; Wu Yiping, ; Zhang Jinsong,

Book ID
111858961
Publisher
IEEE
Year
2004
Weight
458 KB
Volume
0
Category
Article
ISBN-13
9780780386204

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