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Structure characterization of carbon and fluorine-doped silicon oxide films with low dielectric constant

โœ Scribed by Shi-Jin Ding; Li Chen; Xin-Gong Wan; Peng-Fei Wang; Jian-Yun Zhang; David Wei Zhang; Ji-Tao Wang


Book ID
114192666
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
147 KB
Volume
71
Category
Article
ISSN
0254-0584

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Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Efforts have focused on the synthesis and analysis of new polymers with the goals of high thermal s