Structural characterization of through silicon vias

✍ Scribed by Bender, H.; Drijbooms, C.; Marcke, P.; Geypen, J.; Philipsen, H. G. G.; Radisic, A.

• Book ID: 113069877
• Publisher: Springer
• Year: 2010
• Tongue: English
• Weight: 540 KB
• Volume: 47
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-010-5144-6