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Stress relaxation in CuNi thin films

✍ Scribed by Bruckner, W.; Weihnacht, V.


Book ID
118119162
Publisher
American Institute of Physics
Year
1999
Tongue
English
Weight
546 KB
Volume
85
Category
Article
ISSN
0021-8979

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Substrate curvature measurements were used to study both the stress changes during thermal cycling and the kinetics of tensile stress relaxation in 800 nm A1 (0.5wt% Cu)-fiims on oxidized Si-substrates. Qualitative microstructural evidence is provided for the observed decrease in room-temperature st