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Stress relaxation in thin aluminium films

✍ Scribed by V.M. Koleshko; V.F. Belitsky; I.V. Kiryushin


Publisher
Elsevier Science
Year
1986
Tongue
English
Weight
959 KB
Volume
142
Category
Article
ISSN
0040-6090

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Substrate curvature measurements were used to study both the stress changes during thermal cycling and the kinetics of tensile stress relaxation in 800 nm A1 (0.5wt% Cu)-fiims on oxidized Si-substrates. Qualitative microstructural evidence is provided for the observed decrease in room-temperature st