Stress relaxation in Al(Cu) thin films
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J. Proost; A. Witvrouw; P. Cosemans; Ph. Roussel; K. Maex
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Article
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1997
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Elsevier Science
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English
⚖ 529 KB
Substrate curvature measurements were used to study both the stress changes during thermal cycling and the kinetics of tensile stress relaxation in 800 nm A1 (0.5wt% Cu)-fiims on oxidized Si-substrates. Qualitative microstructural evidence is provided for the observed decrease in room-temperature st