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Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate

✍ Scribed by Shang, Xiaogang; Mázur Lauricella, Christiane; Brandi, Sérgio Duarte


Book ID
121335437
Publisher
Trans Tech Publications, Ltd.
Year
2005
Tongue
English
Weight
249 KB
Volume
475-479
Category
Article
ISSN
1662-9752

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