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Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface

✍ Scribed by Abhijit Kar; Mainak Ghosh; Rabindra N. Ghosh; Bhaskar S. Majumdar; Ajoy K. Ray

Book ID
113791216
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
973 KB
Volume
62
Category
Article
ISSN
0167-577X

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Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37 wt% Pb, Sn-3.5 wt% Ag and Sn-4.0 wt% Ag-0.5 wt% Cu were carried out at room temperature over a wide range of strains (1-10%). The fatigue results of both bulk and solder joints were compared; the eute