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Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

✍ Scribed by Kang, S. K.; Lauro, P.; Shih, D.-Y.; Henderson, D. W.; Puttlitz, K. J.

Book ID
121230202
Publisher
IBM
Year
2005
Tongue
English
Weight
749 KB
Volume
49
Category
Article
ISSN
0018-8646

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