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Mechanical and microstructural properties of SnAgCu solder joints

✍ Scribed by Janne J. Sundelin; Sami T. Nurmi; Toivo K. Lepistö; Eero O. Ristolainen

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
862 KB
Volume
420
Category
Article
ISSN
0921-5093

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