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Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150 °C

✍ Scribed by Pei Yao; Ping Liu; Jim Liu

No coin nor oath required. For personal study only.

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Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150&#xa0;°C