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Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

✍ Scribed by B.S.S. Chandra Rao; J. Weng; L. Shen; T.K. Lee; K.Y. Zeng

Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 856 KB
Volume: 87
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2010.04.017

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