๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

โœ Scribed by S. Wiese; K.-J. Wolter

Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
807 KB
Volume
44
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Effect of indium content and rapid solid
Effect of indium content and rapid solidification on microhardness and micro-creep of Sn-Zn eutectic lead free solder alloy
โœ R. M. Shalaby ๐Ÿ“‚ Article ๐Ÿ“… 2010 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 145 KB ๐Ÿ‘ 1 views

## Abstract The Snโ€Zn alloys have been considered as leadโ€free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and microโ€creep of the Snโ€9Zn leadโ€free solders were investigated. It is shown that the a